CSAC2334 Thermal Interface Material (TiM) reliability tester
TenderHighlights
- Tender deadline
- 2 Dec 2026
- Estimated value
- £100,000
- Location
- UKL2
Details
- Published
- 10 Nov 2026
- Tender deadline
- 2 Dec 2026
- Value
- £100,000
- Location
- UKL2
- Source
- Find a Tender
- Source notice ID
- 106792-2026
- OCID
- ocds-h6vhtk-07b8cc
- CPV codes
- 38000000, 71350000
Description
Semiconductor Catapult is interested in Ai characterisation tools and hardware and data centre applications. Thermal management is part of this scope and vision. We would like to expand our capabilities by installing a thermal interface materials reliability tester that is capable of adjusting the bond line measurements and adjusting the pressure applied for each test. The reliability of Thermal interface materials is important for data centre applications.
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Lots (1)
| Lot | Title | Value |
|---|---|---|
| 1 | Lot 1 | £100,000 |