CSAC2334 Thermal Interface Material (TiM) reliability tester

Tender

Semiconductor Catapult

Highlights

Tender deadline
2 Dec 2026
Estimated value
£100,000
Location
UKL2

Details

Published
10 Nov 2026
Tender deadline
2 Dec 2026
Value
£100,000
Location
UKL2
Source
Find a Tender
Source notice ID
106792-2026
OCID
ocds-h6vhtk-07b8cc
CPV codes
38000000, 71350000
View on Find a Tender

Description

Semiconductor Catapult is interested in Ai characterisation tools and hardware and data centre applications. Thermal management is part of this scope and vision. We would like to expand our capabilities by installing a thermal interface materials reliability tester that is capable of adjusting the bond line measurements and adjusting the pressure applied for each test. The reliability of Thermal interface materials is important for data centre applications.

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Lots (1)

LotTitleValue
1Lot 1£100,000