Supply, Delivery and Installation of Backgrind Tape Laminator and De-Taping Kit
ExpiredHighlights
- Deadline
- 17 Aug 2026
- Estimated value
- —
- Location
- UKM82
Details
- Published
- 31 Jul 2026
- Deadline
- 17 Aug 2026
- Value
- —
- Location
- UKM82
- Source
- Public Contracts Scotland
- Source notice ID
- rls-3-JUL561392
- OCID
- ocds-r6ebe6-0000839011
- CPV codes
- 38000000
Description
Background
The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.
The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.
Description
As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6", 8" and 12" thin wafers that are required for photonics.
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Lots (1)
| Lot | Title | Value |
|---|---|---|
| 1 | Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National CeBackground The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description As part of this project NMIS requires an advanced backgrind tape laminator and de-taping turnkey platform to laminate and de-tape 6", 8" and 12" thin wafers that are required for photonics. | — |